{"id":48,"date":"2013-01-14T07:36:15","date_gmt":"2013-01-14T07:36:15","guid":{"rendered":"http:\/\/alpsitec-cmp.com\/en\/?page_id=48"},"modified":"2013-01-14T10:09:24","modified_gmt":"2013-01-14T10:09:24","slug":"e460","status":"publish","type":"page","link":"https:\/\/alpsitec-cmp.com\/en\/e460\/","title":{"rendered":"E460"},"content":{"rendered":"<h1><strong>Advantages<\/strong><\/h1>\n<p><img decoding=\"async\" loading=\"lazy\" class=\"alignright\" style=\"margin-left: 10px; margin-right: 10px;\" title=\"E460_new02\" src=\"http:\/\/alpsitec-cmp.com\/wp-content\/uploads\/2012\/12\/E460_new02-150x150.png\" alt=\"\" width=\"220\" height=\"182\" \/><\/p>\n<ul>\n<li style=\"text-align: justify;\">Quick exchange of parts dedicated to process: platen, carrier and conditioning head (time required 2min).<\/li>\n<li style=\"text-align: justify;\">Perfect for sharing the machine between various teams.<\/li>\n<li style=\"text-align: justify;\">An optimum ratio service \/ costs<\/li>\n<li style=\"text-align: justify;\">A fast and simple tool preparation for process<\/li>\n<li style=\"text-align: justify;\">Solutions for the polishing of small-sized samples: 10mmx10mm, 15mmx15mm, 1 &#8220;, quarter of 2 &#8220;. Any shape can be realized<\/li>\n<li style=\"text-align: justify;\">A recognized robustness<\/li>\n<\/ul>\n<h1>Using<\/h1>\n<p><strong><img decoding=\"async\" loading=\"lazy\" class=\"alignright\" style=\"margin-left: 10px; margin-right: 10px;\" title=\"E460E\" src=\"http:\/\/alpsitec-cmp.com\/wp-content\/uploads\/2012\/12\/E460E.png\" alt=\"\" width=\"220\" height=\"378\" \/><\/strong><\/p>\n<ul>\n<li style=\"text-align: justify;\">The E460 is designed for polishing and planarization of single wafers with diameters between 1&#8243; and 8&#8243;. The optimal use of E460 is in the field of research and development application as well as small scale production requirements due to the machine&#8217;s flexibility.<\/li>\n<li style=\"text-align: justify;\">The number or recorded process recipes is only limited by the hard disk space<\/li>\n<li style=\"text-align: justify;\">The E460 offers 10 process steps totally independent<\/li>\n<li style=\"text-align: justify;\">The step parameters are checked to fit with the tool configuration limits<\/li>\n<li style=\"text-align: justify;\">During process, a specific transition parameter offers a soft evolution of all the step parameters values from the present step settings to the next step settings<\/li>\n<li style=\"text-align: justify;\">Loading is manual. An automatic loading option is under development<\/li>\n<li style=\"text-align: justify;\">The conditioning can be used ex-situ or in-situ during selected steps of the polishing recipe<\/li>\n<li style=\"text-align: justify;\">Plate, carrier and conditioning tool can be exchanged in a few seconds, making possible the sharing of the tool for different processes, different wafers sizes and different teams<\/li>\n<li style=\"text-align: justify;\">The end point detection option is directly integrated in the tool control software for a better integration of that function<\/li>\n<li style=\"text-align: justify;\">The tool can be connected to the internet for distant and immediate support: trouble shooting or tool use training.<\/li>\n<li style=\"text-align: justify;\">Our standard wafer mounting uses inserts, vacuum and back pressure but any king of mounting is possible: wax, templates. Special carrier arrangement can be realized to fit to customers requirements.<\/li>\n<\/ul>\n<h1>Specifications<\/h1>\n<p><a title=\"E460 technical file\" href=\"https:\/\/alpsitec-cmp.com\/en\/e460-technical-file\/\">See the data sheet of the E460<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Advantages Quick exchange of parts dedicated to process: platen, carrier and conditioning head (time required 2min). Perfect for sharing the&#8230;<\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"open","ping_status":"open","template":"","meta":[],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.8 - aioseo.com -->\n\t<meta name=\"description\" content=\"The E 460 has been specially designed for polishing and planarization of substrates platelet diameter of 1 &quot;to 8&quot;.\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<link rel=\"canonical\" href=\"https:\/\/alpsitec-cmp.com\/en\/e460\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.8\" \/>\n\t\t<meta property=\"og:locale\" content=\"en_US\" \/>\n\t\t<meta property=\"og:site_name\" content=\"Alpsitec CMP -\" \/>\n\t\t<meta property=\"og:type\" content=\"article\" \/>\n\t\t<meta property=\"og:title\" content=\"E460 - Alpsitec CMP\" \/>\n\t\t<meta property=\"og:description\" content=\"The E 460 has been specially designed for polishing and planarization of substrates platelet diameter of 1 &quot;to 8&quot;.\" \/>\n\t\t<meta property=\"og:url\" content=\"https:\/\/alpsitec-cmp.com\/en\/e460\/\" \/>\n\t\t<meta property=\"article:published_time\" content=\"2013-01-14T07:36:15+00:00\" \/>\n\t\t<meta property=\"article:modified_time\" content=\"2013-01-14T10:09:24+00:00\" \/>\n\t\t<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n\t\t<meta name=\"twitter:title\" content=\"E460 - 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