Pcox 200s data sheet

Rack
Wafer diameter <= 200 mm
Rotation speed 15 – 150 rpm
Back pressure 0 – 100 kPa
Pressing force 0 – 3000 N
Scan amplitude 0 – maximum
Scan speed 0 – 0.35 m/s
Tray
Diameter 550 mm
Rotation speed 15 – 150 rpm
Temperature 10 – 60°C
Abrasive 0 – 250 ml/min
Conditioner
Tool type brush, disc, diamond ring
Tool diameter 100 – 225 mm
Force 20 – 300 N
Rotation speed 10 – 70 rpm
Scan speed 0 – 0.9 m/s
End point
Module prepared for interfacing with a system for detecting the end of attack DFA2 system from Alpsitec or other system.
Power
Head motor 0.75 kW
Platen motor 2.20 kW
Conditioning motor 0.37 kW
Facilities
Voltage 220V Tri or 400V tri
Compressed air 6 bars
Nitrogen 2 bars
DI water 1 bar
Consumption
Electricity 1 – 2 KWH
DI water 100 L/hour
Vaccum internal vacuum pump
Dimensions
Width 950 mm
Depth 1190 mm
Height 2480 mm
Weight 1000 kg
Wafer dimension 4’’ to 200 mm
Retrofit kit 4″, 5″, 6″
Option module autoloading cassette 1

These characteristics may be modified depending on the evolution of equipment.

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